Intel LGA 1700 & LGA 1800 Socket Design Leaks Out, Designed For Alder Lake & Next-Gen CPUs
The Intel LGA 1700 & LGA 1800 socket that has been designed for Intel's side by side-generation CPUs including the upcoming Alder Lake desktop family has leaked out by Igor's Lab. The socket will power at least two generations of CPUs and could be extended to further back up the next gen.
Intel LGA 1700 & LGA 1800 Socket Design & Blueprints Leak Out, Will Support Alder Lake & Futurity Generation CPUs
Update: The Intel LGA 1700 socket connector has been listed over at Taobao as spotted by HXL. Every bit mentioned here, the socket features an asymmetrical design while the retention bracket is slightly larger than the existing LGA 12**/115* sockets. The socket is listed for a toll of 35 RMB or $5 The states and is only to be sold in bulk.
The Intel LGA 1700 & LGA 1800 socket cover leaked out concluding week which showed us 1 interesting particular, the cover featured labels for both LGA 1700 and LGA 1800 sockets. The LGA 1700 socket will support at to the lowest degree two generations, Alder Lake & Raptor Lake. Only we don't know still what LGA 1800 is designed for. It could be specific to the Xeon-West platform or information technology could exist designed for the very outset 7nm processors arriving in 2023 with Falling star Lake though that's just pure speculation.
Intel LGA 1700 / LGA 1800 Socket Diagram (Epitome Credits: Igor's Lab)
And so as for the socket details, Intel is going with an asymmetrical design which poses since the Alder Lake CPUs are no longer square-shaped. The Alder Lake desktop CPUs will come in a 37.5x45.0mm package and will be supported by the 'V0' socket which we know as LGA 1700. The new socket also changes the mounting positions to a 78x78mm grid rather than a 75x75mm grid. The Z-tiptop has too changed to 6.529mm compared to vii.31mm on the previous LGA 12**/115* sockets.
This would lead to two big changes, kickoff of all, CPU coolers will have to be mounted properly over the CPU which needs to exist confirmed with the vendor prior to installation, and secondly, new and refreshed mounting brackets need to be shipped past libation manufacturers for Intel Alder Lake and LGA 1700 back up. Nosotros have seen MSI already doing this with their upcoming line of Magazine AIO liquid coolers so nosotros can expect other manufacturers to do the same.
Intel LGA 1700 / LGA 1800 Socket Mounting (Epitome Credits: Igor's Lab)
Intel LGA 1700 / LGA 1800 'V0' Socket Details (Credits: Videocardz)
| Specifications | |
|---|---|
| Intel LGA1700 Socket details | |
| IHS to MB Height (Z-Stack, validated range): | 6.529 – 7,532 mm |
| Thermal Solution Hole Pattern: | 78 x 78 mm |
| Socket Seating Plane Pinnacle: | two.vii mm |
| Maximum Thermal Solution Center of Gravity Height from IHS: | 25.4 mm |
| Static Total Compressive Minimum: | 534N (120 lbf), Beginning of Life 356 Northward (lxxx lbf) |
| Cease of life maximum: | 1068 N (240 lbf) |
| Socket Loading: | eighty-240 lbf |
| Dynamic Compressive Maximum: | 489.5 N (110 lbf) |
| Maximum Thermal Solution Mass: | 950 gm |
| Important Note: | A Go on In Zone is introduced for LGA17xx-18xx thermal solutions. Two volumes are provided. The Asymmetric volume provides the maximum available pattern infinite. The Symmetric volume provides for designs to be rotatable on the lath. The thermal solution under load should fit within the volume |
What's interesting is that the Alder Lake CPUs apply an asymmetrical design and while nosotros don't know how the dies will be positioned nether the IHS, nosotros exercise know from AMD Threadripper that CPUs that carry such design require full IHS coverage and that mayhap the tricky part when it comes to cooling the make new Alder Lake CPUs. So far, we know that Alder Lake will be a monolithic yet hybrid cpu design and so it remains to exist seen how cooling is handled for these 12th Generation chips.
Intel LGA 1700 / LGA 1800 Socket Contact Pins (Epitome Credits: Igor's Lab)
As for how the pins would be bundled, the Intel LGA 1700 socket volition utilize a like '50' shaped blueprint with 2 contact areas similar to the existing LGA 1200 socket just but in a much wider compartment since information technology needs to house 500 more pins. The Intel Alder Lake Desktop CPUs are expected to launch in Q4 2021 and will be the first mainstream consumer platform to utilize PCIe5.0 and DDR5 technologies forth with a new hybrid architecture approach, something that Microsoft has optimized for its Windows eleven operating system.
Source: https://wccftech.com/intel-lga-1700-lga-1800-socket-design-leaks-out-designed-for-alder-lake-next-gen-cpus/
Posted by: hannahexis1960.blogspot.com
0 Response to "Intel LGA 1700 & LGA 1800 Socket Design Leaks Out, Designed For Alder Lake & Next-Gen CPUs"
Post a Comment